Aluminum Wafer

Aluminum Wafer Description

Aluminum wafers are widely used in electronics, cosmetic, medicine, culture and education and auto parts. Electrical appliances,heat preservation,machinery manufacturing,automotive, aerospace,military, mold,construction,printing and other industries. Such as kitchen utensils such as non-stick pan,pressure cookers and other hardware supplies such as shades,water heaters shell,is the largest amount of aluminum alloy strip deep processing of one of the products.

Aluminum Wafer Production Methods

Punch processing

1. Rough material cut (cut into a square)

2. Blank (punching into the Aluminum discs you want)

If it is a roll material, it is necessary to open the material.

Aluminum Wafer Alloy state

Main series: 1 series, 3 series, 5 series, 6 series, 8 series is in the majority.

State : O, H ;

Technical Features of Aluminum Wafers Production Line

1. NC automatic, the production line from the coil from the volume, until the whole roll material to complete the middle of the material does not require manual contact with any material, do not need any adjustment, fundamentally put an end to the ordinary punch punch production safety risks and Product quality hidden.

2. The line can use the coil directly to the wafer production, do not need to roll the material slitting and cross-cutting treatment, reducing the production process, reducing the cost of production and reduce the damage to the surface of the material may be produced Wafer to ensure that no oil, no scratches.

3. The line full use of the width of the coil, the use of high-precision servo motor drive system control, so that the wafer spacing and wafer to the material edge of the distance to a minimum, fundamentally reduce the amount of waste, raw material utilization rate of 80% the above.

4. The production rate can reach 40-55 per minute, to improve the production efficiency.

5.Due to the use of modular mold design, when the conversion of wafer production specifications, the conversion time can be reduced to 15 minutes or less. The diameter of the wafer that can be produced ranges from 85 mm to 750 mm.

6. Advanced open system, six heavy leveling machine, high rigidity of the mechanical presses, automatic palletizing system, to ensure that the wafer products of high quality.

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