TSK Series PCB Stress Tester TSK-32-16C

Introduction to PCB Stress Tester A PCB stress tester is an instrument specifically designed to measure stress and strain on printed circuit boards (PCBs). It plays a crucial role in stress and strain testing during the manufacturing processes of PCBA (Printed Circuit Board Assembly) electronic products. Below are some detailed information about it:

 I. Features - Multi-channel acquisition - Some models adopt a modular approach; for example, each strain module may have 8 acquisition channels and can be expanded to 32/64 channels to meet testing needs of different scales. The TSK-32-16C stress tester, for instance, offers such channel expansion capabilities.

 - Multiple interfaces and data storage - Connected via USB interface, it allows long-term data storage on the host hard drive, facilitating subsequent analysis and processing.

 - Support for various strain gauges - Acquisition signals are compatible with 120/350 ohm strain gauges (using different modules), enabling adaptation to different types of strain gauge signals to meet diverse testing scenarios. 

 - High sampling rate - With a sampling rate of 10KHz (capable of simultaneous sampling across 64 channels), this high sampling rate accurately captures changes in stress and strain, ensuring the accuracy and completeness of test data.

 - User-friendly operation - The operation menu is presented in dialog boxes with a Chinese interface, making it simple and quick, reducing the learning curve for operators and improving testing efficiency. - The software is easy to operate and user-friendly, suitable for rapid measurements in factories. It can automatically generate reports with one click according to relevant standards, such as IPC/JEDEC-9704, and some models can also integrate Intel standards to fully automatically generate reports and determine "Pass" or "Failed".

 II. Testing Processes It can perform stress and strain tests on multiple processes during PCB production, including but not limited to: - Board separation stress - Component insertion stress - SMT (Surface Mount Technology) stress - Soldering stress - Dispensing stress - Assembly stress - ICT (In-Circuit Test) stress - FCT (Functional Circuit Test) stress - Drop stress - Vibration stress - Stacking stress, etc.

 III. Testing Methods 

 1. Selection of Strain Test Objects - BGA-type components - Requires selecting BGAs larger than 27*27mm, including but not limited to FCBGA, CBGA. If there are no BGAs larger than 27*27mm on the board, prioritize testing the largest BGA or the BGA with concentrated stress. - Stress-sensitive components - Based on the identification of stress risk points distributed on the board, select the following stress-sensitive components for evaluation: - Ceramic capacitors and ordinary capacitors in 0402 and larger packages (excluding soft-terminal capacitors); for ICT/BST and other processes, test ceramic capacitors in 1206 and larger packages. - Chip resistors, ceramic oscillators, inductors, beads, PLO modules, gas discharge tubes, fuse kits, etc.

 2. Specific Testing Process - Selection and attachment of strain gauges - A strain gauge is a sensor whose resistance changes linearly with the amount of stress. When the strain gauge deforms, its resistance changes accordingly. Attach the strain gauge to the circuit board where testing is needed. - Connecting the instrument - Connect the leads of the strain gauge to the testing instrument of the system. Adjust parameters such as sampling frequency, filter value, gain settings, number of channels, and configure the main channel. Run the test program to check if all channels are connected. - Measuring strain - Place the circuit board in the process to be tested, click start to collect data, then perform the corresponding process action (e.g., screwing, board separation, ICT, etc.). After the action is completed, click stop to end data collection. - Generating reports - Import the collected data into the software, enter the board thickness and strain rate, click generate report, and a stress test report will be produced (automatically generated with one click according to IPC/JEDEC-9704 standards).

 IV. Application Fields In addition to its application in PCB stress testing, it is widely used in other fields, such as: - Large electronic manufacturing plants (e.g., stress testing for PCBs, fixtures, etc.) - Glass stress testing - Bridge stress testing - Building stress testing - Reservoir stress testing - Bolt stress testing - Rail stress testing - Crane stress testing - Ship stress testing - Steel structure stress testing, etc.