Dow CorningSE9187L Transparent: Black, clear, or white; Single-component, no mixing required; Cures with moisture at room temperature, no oven needed; Solvent-free, no ventilation required; Short surface drying time, improving online processing speed; Curing can also be accelerated by heating; Very low viscosity, allowing rapid flow/filling/self-leveling after application; Refined low volatility reduces volatiles that may affect surrounding components; UL94HB flame retardant rating.

I. Product Features:

1. Provides both bonding and excellent thermal conductivity and heat dissipation.

2. Neutral curing, non-corrosive to most metals.

3. Resistant to thermal cycling, aging, and offers electrical insulation properties.

4. The adhesive layer has excellent moisture resistance, shock resistance, corona resistance, and leakage resistance.

5. Fully compliant with EU ROHS directive requirements.

DOWSIL SE9187L Sealant Characteristics: Fast-drying, non-corrosive.

Application Scope: Commonly used for sealing electronic devices, module fixation, bonding, and LCD assembly modules. Features and Uses:

1. Improves the reliability of sensitive circuits and components, extending service life.

2. Insulation, shock absorption, impact resistance, dustproof, with a wide operating temperature and humidity range (-50°C to +250°C).

3. Weather-resistant, chemically resistant, and heat-resistant.

4. Outdoor use eliminates adverse effects of UV light, ozone, moisture, and chemicals.

5. Excellent bonding performance, with strong adhesion to metals, glass, ceramics, and plastics.6. Used for protection and bonding of flexible and rigid circuit boards and various circuits.

Usage Method: Thoroughly clean and dry the surface to be bonded, apply the adhesive as needed, and expose to air. Surface curing occurs in 5-8 minutes at room temperature. Avoid contact with eyes during application. Avoid high temperatures and open flames in the application area and ensure adequate ventilation.