WACKER P12 by Wacker, Germany

Widely used at the junction between power devices and heat sinks, applying thermal paste reduces thermal resistance. Characteristics: Wacker P12 is a soft and pure thermal paste with significant thermal conductivity, nearly doubling heat transfer from the cavity to the heat sink. WACKER Silicone Paste P 12 is used in the semiconductor industry as thermal grease. Whenever good thermal conduction is needed between semiconductor materials and cooling devices, using WACKER Silicone Paste P 12 is a wise choice. In integrated semiconductors, such as diodes, transistors, and thyristors, tiny electronic layers exist on the surfaces of semiconductor materials and cooling surfaces if they are not flattened or polished. When these surfaces are integrated, a rigid metal-to-metal contact only creates gaps between them. 40%-60% of the surfaces do not make direct contact, depending on roughness. This means that these hollow gaps are filled with air, which does not conduct heat. By applying WACKER Silicone Paste P 12 to the surfaces, the insulating air is replaced by thermally conductive grease when the components are tightened. The thermal conductivity of WACKER Silicone Paste P 12 is more than 20 times that of air. Experiments have shown that using WACKER Silicone Paste P 12 can double the thermal conductivity from semiconductors to cooling devices. WACKER Silicone Paste P 12 can be applied with a brush, spatula, or screen printing. Forming a uniform and very thin coating on the surface achieves optimal results. When components are tightened, the excess grease is squeezed out and can be removed.