Copper Clad Laminate (Copper Film)
Copper foil: Generally divided into electrolytic copper and rolled copper. Common thicknesses include 1oz, 1/2oz, and 1/3oz.
Substrate film: Common thicknesses are 1mil and 1/2mil.
Adhesive: Thickness determined according to customer requirements.
Cover Film
Cover film: Used for surface insulation. Common thicknesses are 1mil and 1/2mil.
Adhesive: Thickness determined according to customer requirements.
Release paper: Prevents the adhesive from picking up foreign matter before lamination; facilitates operation.
PI Stiffener Film
Stiffener: Reinforces the mechanical strength of FPC, facilitating surface mounting operations. Common thicknesses range from 3mil to 9mil.
Adhesive: Thickness determined according to customer requirements.
Release paper: Prevents the adhesive from picking up foreign matter before lamination.
EMI: Electromagnetic shielding film, protects the circuits on the board from external interference (strong electromagnetic areas or interference-prone areas).