Product Description:

(1) Properties: Epoxy AB adhesive, 1:1 ratio, cures at room temperature;

(2) Features: Fast dispensing speed, excellent leveling, environmentally friendly and odorless, high bonding strength, resistance to high and low temperatures, low shrinkage and stress, capable of withstanding soldering high temperatures.

(3) Specifications: Curing time options include room temperature/30 minutes/2 hours/4 hours. Available in 50g/tube, 1kg/jar, or 25kg/drum, with components A and B packaged separately.

We specialize in the development and production of electronic-grade adhesives, offering professional interconnect and protective electronic material products, all for your better connection and communication.